Chemical-Mechanical Planarization (CMP) and Post-CMP Cleaning
CMP has been a long term interest of our group. We investigate the
mechanisms of polishing, planarization, and cleaning. The surface
properties and interfacial reactions are studied. Effects of particles,
surfactant molecules, as well as micro- and nano-mechanical forces of
solids and fluids are studied. Research results help microelectronic
industry to understand and optimize manufacturing processes.