Chemical-Mechanical Planarization (CMP) and Post-CMP Cleaning

CMP has been a long term interest of our group. We investigate the mechanisms of polishing, planarization, and cleaning. The surface properties and interfacial reactions are studied. Effects of particles, surfactant molecules, as well as micro- and nano-mechanical forces of solids and fluids are studied. Research results help microelectronic industry to understand and optimize manufacturing processes.




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